Bakit EK Neu


  • solvent-free and very low emission
  • contains no silicon or isocyanate
  • suitable for hard to adhere wood
  • one-component, ready to use
  • bridges cracks with engineered wood
  • cures to elastic bond layer
  • easy handling and spreading
  • suitable over floor heating systems
  • very low emission EC1R according to GEV
  • 0,0 g/L VOC
  • contributes to LEED
Solvent-, silicon- and isocyanate-free ready to use one-component adhesive for elastic installation of different wood floorings, e.g. solid and engineered wood flooring, prefinished wood flooring in a variety of thicknesses as parquet, plank or strip. Also suitable for sensitive and hard to adhere woods, please contact our Technical Service Department. Suitable for installation on cement-based screed, Calcium sulfate -based screed, asphalt mastic screed, wood chipboards and substrates prepared with suitable Kiesel leveling compounds. Suitable for various types of parquet/wood flooring; as mosaic parquet, engineered wood from 16mm thickness with tongue and groove, industrial parquet 10-23 mm, wood block RE (DIN 68 702) with a max. height of 50 mm, prefinished 2-, 3- and multi-layered in boards and planks, solid wood flooring from 15 mm thick (thickness to width ratio max 1:10) up to a length of 270 cm. Bamboo flooring (except Stranded Bamboo). Solid wood must be straight and flat. Strip flooring, shorts and planks. Existing stone, ceramic and terrazzo must be combined with Okapox GF /and silica sand spread (please note that in this case the adhesive consumption will increase). Contact Kiesel technical department. When using as a moisture barrier up to 92% RH (using an in-situ probe) use a flat trowel and create a moisture skin barrier to a unified layer without any pinholes or breaks with at least 2mm thickness. Wait minimum 12 hours or until it is cured before installation of recommended coverings. Contact Kiesel technical department when installing any kind of exotic wood. For installations over cement screed, calcium sulfate screed (flowing), particleboard V 100 E1, OSB boards, suitable Kiesel levelling compounds.


Substrate preparation The substrate must comply with VOB Part C, DIN 18 356 as well as with all local technical and national requirements and must be ready for installation. Moisture content of all floors must be measured before installation. Approved substrates: plywood (underlayment grade), OSB (underlayment grade), Kiesel recommended screeds, patching and levelling compounds, radiant heat flooring. The surface must be sound and clean. Remove dirt, paint, oil, grease, wax and other contamination, which might act as a bond breaker. Grind and prime calcium sulfate screed according to data sheet BEB. If necessary, prime with Okapox GF /and silica sand spread, Okamul PU-V schnell and install within 24 hours. Prime absorbent substrates (cement-screed, calcium sulfate-based screed) with Okamul PV-Universal to reduce fine dust. Moisture content in concrete sub floors must be below 3/24h/1,000 sq. ft. using the Calcium Chloride Test or below 75% RH using an in-situ probe. When used as moisture barrier up to 14/24h/1,000 sq. ft. using the Calcium Chloride Test or up to 92% RH using an in-situ probe may be achieved and is warranted. Bakit EK neu should be used as a product component together with other Kiesel floor installation system products. Processing Use appropriate trowel to apply the adhesive onto the substrate. Spread the adhesive with the appropriate notched trowel. Avoid unnecessary adhesive thickness by passing the trowel evenly through the adhesive at a 45 degree angle. Installation should begin immediately; no flash time required. Lay the flooring into the adhesive, correctly position it and press down firmly. Rolling is neither required nor recommended. Check the boards regularly to make certain good adhesive transfer from floor to flooring is accomplished. Apply only as much as adhesive as required and imbed within 40 minutes. Push the covering into the adhesive bed; plane into position and push until tight. Ensure even and thorough transfer of the adhesive. Remove adhesive residue on floor surface immediately with Bakit RT. Please follow flooring manufacturer installation instructions.
Color brown and beige
Minimum floor temperature +15°C (59 °F)
Skin over time* / Tack time none
Processing time* approx. 40 minutes
Ready for traffic* after approx. 24 hours engineered wood flooring after approx. 12 hours
Ready for sanding* after approx. 24 hours
Floor heating system suitable
GISCODE RS 10 acc. to TRGS 610
Storage store in frost protected area for up to 6 months


At 68 °F (+20 °C) and 65 % relative humidity. Higher temperatures and lower humidity decreases, lower temperature and high humidity increase this value respectively. Coverage
Tooth Type Type of parquet Consumption
TKB B3/B6 Mosaic parquet (DIN EN 13488) approx. 700-900 g/m² 76-98 sq. ft. per US gal.
TKB B6/B7 Industrial wood flooring 10-23 mm (DIN EN 14761) Engineered wood flooring (DIN EN 13489) approx. 800-1000 g/m² 55-76 sq. ft. per US gal.
TKB B15 Solid strip 22 mm tongue and groove (DIN EN 13226) Wood blocks RE (DIN 68702) Wood planks (DIN EN 13226) Engineered wood flooring planks (DIN EN 13489) approx. 1000-1200g/m² 38-55 sq. ft. per US gal.
Coverage may vary and it depends on substrate and other construction related factors. Cleaning Clean tools with Bakit RT immediately after usage Packaging
Packaging Item no. EAN
33 x 17 kg plastic buckets color brown 46048 4015705460482
33 x 17 kg plastic buckets color beige 46049 4015705460499
The aforementioned information, especially the proposals for processing and utilizing our product, is based on our knowledge and experience. We recommend that you carry out your own tests in every case to ensure the suitability of our products for the intended process and processing purposes because of the different materials and the working conditions which lie beyond our area of influence. No liability can be derived from this advice or from verbal advice, unless we are responsible for (criminal) intent or gross negligence in this respect.